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Lee Hyo-seok AcademyOctober 28, 2026

US Big Tech was not Samsung Foundry’s No. 1 sales priority... Samsung’s bet on 2nm to reshape semiconductors [Monthly Asin, 10 edition full interview]

An independent exercise, not a statement by the video creator or verification of every claim in the video.

Higher HBM prices and higher profits are different calculations

Use hypothetical units, not actual company figures. With volume of 100, a unit price of 10 and unit manufacturing and outsourcing costs of 6, revenue is 1000 and the amount remaining after those costs is 400. In the next period, even if the price rises 20% to 12, volume falling to 90 and unit costs rising to 8 produce revenue of 1080 and a remaining amount of 360. Revenue rises 8%, but the remaining amount falls 10%. To assess base-die upgrades, examine customer volumes, product mix, good-die yield, outsourcing costs and suppliers’ design contributions alongside price increases.

Check for yourself

  1. Does the price forecast compare the same product at equal capacity, or does it include a shift toward higher-value products?
  2. When base-die functionality grows, does the additional selling price outweigh additional manufacturing and outsourcing costs?
  3. Is there evidence that a partnership has translated into customer qualification, mass production, deliveries and earnings?

Limits of application

The remaining amount in this simplified calculation is not operating or net profit after research, selling, administrative expenses and taxes. It does not estimate actual HBM contracts, price increases, yields or the division of earnings among suppliers.

What to look for
Distinguish memory-volume growth from value capture by tracing competition from HBM pricing to base dies, packaging and networks.
Why it matters
Examine customer pricing, product mix, yield and outsourcing costs together, then test whether roadmaps and partnerships translate into actual orders, earnings and shareholder returns.

Timeline

9 segments
  1. The guest interprets Samsung’s base-die development and collaboration with custom-AI-chip customers as a strategy integrating memory, foundry and advanced packaging. The central question is not merely memory volume, but who secures differentiation and bargaining power through design, interfaces and system efficiency. The title’s claim about internal sales priorities and customer-specific allocation has not been established here as a confirmed corporate disclosure.

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Educational information only; not investment advice.